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2nd International Conference on Photonics and Opto Packaging

This conference relates to those involved with the design of systems and development of components as well as end users and will address issues of placement of die and components, die and component packaging for emerging optoelectronic technology applications. Interconnection technologies will be a key feature of the presentations and the event will offer the opportunity to learn about emerging photonics and opto-technology, process tools and flows, materials and equipment selection/options as well as design/industrialisation aspects.

Bay Photonics will present at this event on some of the challenges in TERAPOD.